Huawei publishes chip related patents

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Today, Huawei Technology Co., Ltd. announced the patent of “chip, manufacturing method of chip and electronic equipment”, with the publication number of cn113367a.

According to the patent abstract of enterprise investigation, the application belongs to the field of chip heat dissipation technology. By installing a heat conducting plate between two adjacent silicon wafers, the heat on the silicon wafers can be transmitted to the heat conducting plate, the temperature on the silicon wafers can be reduced, and the heat dissipation capacity of the chip can be improved, so as to avoid the chip burning caused by the accumulation of a large amount of heat on the silicon wafers.

The chip of the patent comprises a shell, a plurality of silicon wafers and a plurality of heat conducting sheets, wherein the plurality of silicon wafers and the plurality of heat conducting sheets are stacked and installed in the shell; The heat conducting sheet is installed between the two adjacent silicon wafers, and the edge of the heat conducting sheet extends out of the gap between the two adjacent silicon wafers.